In response to the demand for precise sealing of microchips and microsensors, a new ultra-low viscosity electronic-grade silicone oil product has been officially launched on the market, filling the gap in the market for lightweight encapsulation materials for tiny components.
The traditional electronic silicone oil has a high viscosity and poor fluidity, unable to penetrate micrometer-sized gaps. Air bubbles are easily trapped inside small and precise circuit boards, leading to short circuit faults over time. This new type of silicone oil has a viscosity of only 5 cst, with fluidity close to pure water. It can quickly fill the gaps of chip pins and micro capacitors, ensuring no air bubbles or voids during encapsulation. The product can withstand a wide temperature range of -50°C to 230°C, maintaining stable insulation strength and not shrinking or cracking with temperature changes.
At the same time, this product has low ions and low volatility, and does not contain heavy metals or cyclosiloxanes, meeting the strict production standards for semiconductors, wearable smart devices, and Bluetooth earphone mainboards. Compared to conventional insulating materials, the ultra-low viscosity silicone oil is lightweight and thin, without increasing the weight of small digital products. It is suitable for the trend of lightweight electronic product production.
Currently, this silicone oil has been supplied to several smart wearable and Bluetooth earphone manufacturing factories, for use in preventing moisture on the mainboard, heat dissipation filling, etc. Manufacturer test data shows that after using the ultra-low viscosity silicone oil for encapsulation, the salt spray protection time of the components has doubled, and the failure rate of outdoor equipment has decreased by 60%. Domestic special silicone oil is continuously exerting efforts in the microelectronics market segment, gradually achieving independent supply of high-end electronic raw materials.