Hydroxyfluorosilicone oil has significant advantages in the field of electronic packaging, mainly reflected in the following aspects:
1. Excellent electrical insulation performance
Hydroxyfluorosilicone oil has high electrical insulation properties and can effectively protect electronic components from the risk of electrical breakdown or short circuit. Its dielectric strength is high and its relative dielectric constant is low. For example, some packaging materials based on fluorosilicone oil have a dielectric strength of up to 22.6 kV/mm. This characteristic makes it perform well in high-voltage, high-power electronic device packaging.
2. High temperature resistance and chemical corrosion resistance
Due to the introduction of trifluoropropyl groups, hydroxyfluorosilicone oil exhibits excellent resistance to high temperatures and chemical corrosion. It can maintain stability in extreme temperatures and chemical environments, and is suitable for electronic component packaging in high-temperature environments, such as IGBT modules. Its operating temperature range is generally between -60 ℃ and 200 ℃, and some products can even be used for a long time under conditions of -50 ℃ to 250 ℃.
3. Low internal stress and good mechanical properties
The cured hydroxyl fluorosilicone oil has low internal stress, which can reduce mechanical stress on electronic components, thereby improving the reliability of packaging and the service life of components. Meanwhile, its excellent mechanical properties enable it to withstand certain physical impacts and vibrations, ensuring the stability of the packaging.
4. Low volatility and low water absorption
The low volatility and low water absorption of hydroxy fluorosilicone oil make it perform well in electronic packaging. Low volatility reduces the volatilization loss of materials in high temperature or vacuum environments, while low water absorption prevents moisture from corroding electronic components.