The three main materials of electronic packaging are substrate materials, plastic packaging materials, lead frames and solders. Among plastic packaging materials, epoxy plastic packaging materials (EMC) are the mainstream of integrated circuit packaging at home and abroad. In EMC, the content of silicon dioxide powder accounts for 60% to 90%. In electronic packaging, high moisture resistance, low stress, low alpha radiation, resistance to dip soldering and reflow soldering, and good plastic packaging process performance are mainly required after integrated circuit packaging. In response to these requirements, the epoxy molding compound must be doped with inorganic fillers in the resin matrix. The current inorganic fillers are basically silica powder, which can reduce the thermal expansion coefficient of the molding compound, increase the thermal conductivity, and reduce the dielectric constant, which is environmentally friendly. , Flame retardant, reduce internal stress, prevent moisture absorption, increase the strength of the plastic packaging material, and reduce the cost of the packaging material.