IOTA M8760 is a two-component room-temperature curing addition-type thermally conductive organic silicone potting compound. The mixing ratio is 1:1, with a mixed viscosity of approximately 4500 mPa·s. After curing, the hardness is 60 Shore A, the thermal conductivity is 0.7 W/m·K, it is flame retardant UL94-V0, the dielectric strength is 23 kV/mm, and the volume resistivity is 10¹⁵ Ω·cm. Product introduction: It belongs to medium-low thermal conductivity, general protective type organic silicone potting compound, suitable for automotive electronics, power supplies, solar energy, sensors, etc. where there are no high requirements for heat dissipation but insulation, flame retardancy, and environmental resistance are needed for potting scenarios. Product introduction, 3, 5
Key performance data (after 23±2℃ curing for 24 hours)
Performance Values Explanation
Performance Values Explanation
Mixed viscosity 4500 mPa·s Good fluidity, easy to eliminate bubbles and level out
Room temperature operation time 2 h 23±2℃ conditions
Density 1.6 g/cm³ Medium filler content
Hardness 60 Shore A Relatively hard, good mechanical protection
Tensile strength 2.0 MPa Lower than structural adhesives, suitable for potting
Elongation 150% Medium elasticity
Thermal conductivity 0.7 W/m·K Medium-low thermal conductivity, suitable for low-power devices
Dielectric strength 23 kV/mm Good insulation performance
Volume resistivity 10¹⁵ Ω·cm High insulation
Flame retardant grade UL94-V0 Meet automotive regulations/storage requirements
Curing time: 8 h at 23℃, 15 min at 100℃, 5 min at 150℃ (1 cm thickness). Product Introduction
What does a thermal conductivity of 0.7 W/m·K mean?
0.7 W/m·K falls within the medium to low thermal conductivity range. The industry standard selection logic is as follows:
0.6–0.8 W/m·K: Suitable for low-power boards, sensors, ordinary power modules, solar junction boxes, etc.;
1.0–1.5 W/m·K: Suitable for energy storage BMS, ordinary inverters, medium-power power supplies;
1.5–2.0 W/m·K: Suitable for motor controllers, on-board electronics, higher-power modules;
≥2.0 W/m·K: Suitable for high-power silicon carbide modules, OBCs, charging piles, high-power LED drivers.
The 0.7 W/m·K of M8760 indicates that it is not a high-heat dissipation solution and is more suitable for scenarios that prioritize protection over heat dissipation. If the application involves high-power components, 800V platforms, IGBT/SiC modules, or continuous high heat, 0.7 W/m·K may be insufficient and the 1.0–2.0 W/m·K or higher thermal conductivity grade products need to be evaluated.
Test method description
The thermal conductivity detection method in the materials is labeled as GB/T 10297-1998, which has been replaced by GB/T 10297-2015 "Determination of Thermal Conductivity of Non-metallic Solid Materials - Hot Wire Method". GB/T 10297-2015 is applicable to isotropic homogeneous non-metallic solid materials with a thermal conductivity less than 2 W/(m·K), serving as a supplementary method for steady-state tests, and is suitable for enterprise quality control, but not for certification or arbitration tests.
When requesting the TDS from the supplier, it is recommended to confirm if the test method has been updated according to GB/T 10297-2015.
Differences from other series of IOTA
Series Core positioning Typical applications Comparison with M8760
Series Core positioning Typical applications Comparison with M8760
M8760 Thermal conductive adhesive for room temperature curing Power supplies, automotive electronics, solar energy, sensors Thermal conductivity 0.7 W/m·K, UL94-V0, encapsulation protection
M7140 Electronic button-specific LSR Buttons, keyboard protection cases, 3C sealing Transparent, fatigue-resistant, non-thermal encapsulation
M6750 Cookware food-grade LSR Cookware, baking molds, food contact Compliant with BfR/FDA, VOC ≤0.4%
M6040K High bite force LSR Forming, insert injection molding Stronger adhesion to the substrate
M6020 General two-stage curing LSR for infants and children care, food contact, sealing General food grade, no thermal conductivity requirements
M8760 does not belong to the same application system as the previous LSRs: LSRs are mainly used for injection/molded products, while M8760 is an encapsulant for PCBs, power modules, sensors, junction boxes, etc. in electronic packaging scenarios. Product introduction, 5
Selection verification checklist
Is the heat dissipation sufficient?
Confirm the heat generation power of the component, shell temperature limit, heat dissipation path, and allowable temperature rise. 0.7 W/m·K is suitable for low-power or modules with low heat dissipation requirements; for high-power scenarios, products with 1.0 W/m·K or higher are needed.
Insulation and withstand voltage
The dielectric strength of M8760 is 23 kV/mm, and the volume resistivity is 10¹⁵ Ω·cm. For conventional low/medium voltage power supplies, it is usually sufficient; if used on an 800V high-voltage platform, the breakdown voltage and creepage distance need to be verified in combination with the electric field distribution. Product introduction, 3
Flame retardancy requirements
UL94-V0 is the basic entry requirement for new energy vehicles, energy storage, and power supplies. M8760 has met this requirement. Product introduction, 3
Viscosity and bubble removal
The mixed viscosity is 4500 mPa·s. The fluidity is good, but when filling complex structures or narrow gaps, it is still recommended to assess whether vacuum defoaming is necessary. Product Introduction
Adhesion compatibility with the substrate
The label states "Strong adhesion", but no specific substrate or peel strength data is provided. The adhesive reliability needs to be verified on actual PCBs, aluminum shells, plastic casings, copper strips, etc. Product Introduction
High and low temperature and cold and hot cycle
The organic silicone potting compound usually has a wide temperature tolerance range, but the specific upper limit of the operating temperature, thermal expansion coefficient, and cold and hot cycle life have not been provided in the materials. It needs to be verified according to the actual working conditions.
Risk of catalyst poisoning
M8760 is a platinum-based catalytic system. Contact with sulfur, phosphorus, nitrogen, organotin, and amine substances may inhibit curing. PCB flux residues, certain adhesives, rubber parts, and surfaces containing tin need to be checked. Product Introduction
Filler settling and batch consistency
The data indicates that it is necessary to thoroughly mix before use to prevent filler settling. The potting compound has high requirements for consistency in thermal conductivity and insulation. It is recommended to verify the stability of viscosity, thermal conductivity, and curing speed for different batches. Product Introduction
What materials should be requested from the supplier?
It is recommended to request the complete TDS/SDS from the supplier, and focus on confirming the following: whether the thermal conductivity test standard has been updated to GB/T 10297-2015; the UL94-V0 certificate number; the test conditions for dielectric strength, volume resistance, and surface resistance; the testing base materials and methods for adhesion; the recommended operating temperature range; the data for cold heat cycling, humidity aging, and salt spray aging; whether RoHS/REACH has been passed; whether a higher thermal conductivity version is provided.
Typical applicable and non-applicable scenarios
Applicable: ordinary power module encapsulation, solar junction box/optimizer, sensor packaging, low-voltage electronic control module, vehicle low-voltage electronics, LED driver, low-power board card protection.
Cautionary use: high-power IGBT/SiC modules, 800V high-voltage platform, continuous high heat flux density devices, precision chip packaging requiring extremely low stress.
Non-applicable: food contact, baby and children's products, medical implant/contamination-related applications; need for high structural strength for bonding fixation; appearance parts requiring transparent appearance.
FAQ
1. Is the thermal conductivity of M8760 sufficient?
Check the device power and heat dissipation design. 0.7 W/m·K is suitable for low-power or protective encapsulation; if the module continues to generate significant heat and the shell temperature is too high, it is recommended to evaluate 1.0–2.0 W/m·K or higher thermal conductivity products.
2. Can it be used in the electrical control system of new energy vehicles?
It can be used for low heat load parts such as low-voltage sensors, auxiliary power supplies, and some modules of the BMS; motor controllers, OBCs, and high-voltage power modules usually recommend 1.0–2.0 W/m·K or higher, and verify the breakdown voltage and cold-hot cycle.
3. Why is there such a big difference in curing time?
At room temperature (23℃), it takes 8 hours; at 100℃, it only takes 15 minutes; at 150℃, it only takes 5 minutes. In mass production, heating to accelerate curing is usually adopted, but it is necessary to confirm whether the internal part of thick-walled components can be uniformly heated. Product Introduction
4. Is a viscosity of 4500 mPa·s considered high?
It falls into the category of medium-low viscosity, suitable for self-leveling encapsulation. However, if the structure is complex, the gap is small, or there is sensitivity to bubbles, vacuum degassing is still recommended. Product introduction, 5
5. Why must catalyst poisoning be avoided?
The platinum-based catalytic system may not cure or the surface may become sticky when encountering sulfur, phosphorus, nitrogen, organotin, and amine substances. PCB flux, certain rubber, tin plating, and some adhesives need to be checked in advance. Product Introduction