On July 19th, Xiaomi's first small foldable screen device - Xiaomi MIX Flip was launched with great fanfare. In terms of performance, Xiaomi MIX Flip is equipped with the third-generation Snapdragon 8 mobile platform, offering decent performance. Corresponding to the powerful performance release is the topic of the cooling component. For ultra-thin foldable screen devices, the efficiency ratio of performance and temperature control is even more important. The special body shape determines that the mature cooling solutions on straight-panel devices cannot be directly applied to the Flip small foldable product. To ensure the full performance of the platform, Xiaomi, with a global perspective, redesigned a three-dimensional cooling system for MIX Flip, comprehensively considering aspects such as heat conduction, heat distribution, and heat insulation. 
In terms of heat conduction, the VC structure of Xiaomi MIX Flip adopts an integrated design for the middle frame, with the VC serving as part of the middle frame, enabling the introduction of a large-area VC heat dissipation plate in the product form with extremely limited space, with an area of 3500 square millimeters, resulting in higher heat conduction efficiency.
In terms of heat dissipation, Xiaomi MIX Flip solves the impact of the folding hinge on heat dissipation and temperature uniformity by laying down double-layer large-area graphene flexible materials. One layer crosses over the hinge from above, and the other layer adheres to the main FPC and passes through the hinge. The heat conduction capacity has increased by 30%.
In terms of heat insulation, the use of aerogel is an ideal solution. Xiaomi MIX Flip fills the aerogel material at the VC "step" position, effectively isolating the heat generated at the SoC position from being transmitted upward to the inner screen, improving the thermal perception when users touch the screen.
In recent years, multiple electric vehicles such as Xiaomi SU7 have used aerogel as an insulation material in their battery system designs multiple times. However, the use of aerogel in the heat dissipation system design of foldable screen mobile phones is still the first time. What are the magical properties of a small piece of aerogel?
Aerogel is a porous material. Its internal pore structure can reduce heat conduction, effectively isolating the transfer of heat. Compared with traditional insulation materials, the thermal conductivity of aerogel insulation pads is lower, and the insulation effect is better. Therefore, when the SoC position generates a large amount of heat, the aerogel material can ensure effective insulation, ensuring the safe operation of the system. The aerogel insulation pad also has the characteristic of lightweight. Compared with traditional insulation materials, it has a lower density and lighter weight. This not only reduces the load of the device but also saves material space and costs. In the design of the mobile phone thermal management system, using aerogel can achieve effective insulation while also being lightweight, improving the overall performance of the system.